MicroXAM - 100

光學式表面量測儀及干攝儀

From: http://www.kla-tencor.com/surface-profiling/microxam-100.html

Formerly the Ambios Xi-100 Plus - Surface Profilometer and Optical Interferometer

Laser scribe line on glass(雷射在玻璃上的刻線)

The KLA-Tencor Development Series of 3D surface profilers offer a complete optical surface profiling solution focusing on the needs of the engineering and research community. Our 3D surface profiler and optical interferometer products are designed to match the varied requirements of our customers through the delivery of full featured optical surface profiler products, integration of new technologies, and improved performance.

聚焦於工程及研究社群, KLA-Tencor的研發系列的3維表面量測儀 , 提供了一個完整的光學式表面量測解決方案. 經由功能完備的光學式表面量測產品的遞送, 新科技的整合, 以及增進的性能, Development 系列的表面量測儀產品, 我們的3維表面量測儀, 以及光學干攝儀產品, 是為了符合客戶的各種不同的需求而設計的.

250 μm closed loop vertical range
PSI (phase) and VSI mode (vertical)
100mm x 100mm manual sample positioning stage (optional 100mm x 100mm motorized stage)
Solid State light source
Optional stitching and auto alignment of images
Windows XP and Vista compatible

250μm 閉回路的垂直範圍, PSI(相)及VSI(垂直)模式

100mm x 100mm 手動樣品定位平台(可選配100mm x 100mm 電動平台)

固態光源, 影像的光學縫接及對齊.

Windows XP 及 Vista 相容.

The MicroXAM-100 3D surface profiler and optical interferometer complements our optical surface profiling portfolio by combining white light and phase-shifting interferometry for precise, non-destructive surface measurements that are internally and permanently referenced to a standard wavelength of light. The 3D surface profilers and optical inteferometer system provides precise, high-resolution, non-contact 3D profiles of both smooth and rough surfaces. The intuitive Windows user interface allows simple and reproducible program navigation.

經由結合了白光及相偏移干攝儀於精準, 非破壞式表面量測(它由內部且恆定地參考一個標準波長的光), MicroXAM-100 三維表面量測儀以及光學干攝儀, 補足了我們的光學式表面量測產品線.此三維表面量測儀以及光學干攝儀提供精準的, 高解析度的, 非接觸式的平滑或粗糙表面的三維表面量測. 直覺的 Windows 使用介面, 容許簡易及可重複的程式的巡迴操作.

The MicroXAM -100 3D surface profiler and optical interferometer can measure fields of view from 100 X 100 microns to 2.0 X 2.0 millimeters (dependent on the objective lens used). The MicroXAM 3D surface profiler and 100 optical interferometer quickly and accurately measures the 3D topography of surfaces at the nanometer level with 0.1 nm z-resolution (scan setup dependant) a z-scan range of 250 microns (or up to 10 mm with Z-Stitching). With the new 3D image stitching capabilities, multiple images can be stitched together to produce an extended fields of view.

MicroXAM-100 三維表面量測儀以及光學干攝儀, 能夠量測的觀測全域, 從 100 X 100 microns 到 2.0 X 2.0 mm(依所使用的物鏡而定). MicroXAM-100 三維表面量測儀以及光學干攝儀 , 在250 microns 的Z方向(垂直) 的掃描範圍(或經由Z方向的影像縫接), 以 0.1nm 的耐米等級的Z方向的解析度, 快速且準確地量測表面的三維型貌. 新的三維影像縫接能力, 多個影像能夠被縫接在一起, 得到一個括充的觀測全域.

Applications:
Surface Texture Precision step height Surface form Thin film stress Biological MEMS 3D imaging Material Characterization

應用:

表面文理, 精確的梯度高度, 表面型狀, 較薄薄膜的應力, 生物學, 微機電元件, 三維影像, 材料特性等.

RELATED INFORMATION(下載)

MicroXAM-100 Product Overview
MicroXAM-100 Product Overview:

OVERVIEW
The MicroXAM-100 complements our surface profiling portfolio with a research grade, non-contact optical profiler. The MicroXAM-100 is a full-featured white light and phase-shifting interferometer that brings a powerful set of features and capabilities to the general research community.

以研究的等級, 非接觸式的光學表面量測, MicroXAM-100 補足了我們的表面量測的產品線. MicroXAM-100 是一個功能齊全的白光及相偏移干攝儀, 帶給一般的研究社群一組功能強大的特點與能力.

The system provides precise high-resolution, non-contact 3D profiles on both smooth and rough surfaces. The intuitive user interface allows for a fast learning curve ensuring quick and productive use of the tool in any environment.

此系統提供精準, 高解析度, 非接觸式的的平滑或粗糙表面的三維型貌量測. 直覺的使用介面, 允許一個快的學習曲線, 確保在任何環境下, 可以快速且有生產力地使用這個工具.

The MicroXAM -100 3D surface profiler and optical interferometer can measure fields of view from 100 X 100 microns to 2.0 X 2.0 millimeters (dependent on the objective lens used).

MicroXAM-100 三維表面量測儀以及光學干攝儀, 能夠量測的觀測全域, 從 100 X 100 microns 到 2.0 X 2.0 mm(依所使用的物鏡而定).

The MicroXAM 100 optical interferometer quickly and accurately measures the 3D topography of surfaces at the nanometer level with 0.1 nm z-resolution (scan setupdependant) and a z-scan range of 250 microns (or up to 10 mm with Z-Stitching). With the new 3D image stitching capabilities, multiple images can be stitched together to produce an extended fields of view.

MicroXAM-100 光學干攝儀 , 以 0.1nm 的耐米等級的Z方向的解析度以及在250 microns 的Z方向(垂直) 的掃描範圍(或經由Z方向的影像縫接), 快速且準確地量測表面的三維型貌. 新的三維影像縫接能力, 多個影像能夠被縫接在一起, 得到一個括充的觀測全域.

BENEFITS(優點與幫助)

Full 3D rendering ability with profile extraction(具有剖面提取的完整的3D呈現能力)

Meets calculations for roughness, waviness,step height, and geometry(符合表面粗糙度, 波紋度, 梯度高度及幾何的計算需求)

Easy sample navigation using intuitive graphical user interface and video view(使用直覺的圖型使用介面, 及影像)

Transfer data seamlessly to other Windows programs for display and analysis with online help system(綿密地傳輸數據資料到其他的Windows 程式, 並以線上輔助系統來加以分析)

Optional advanced image analysis from Image Metrology SPIP™ for 3D rendering, FFT filtering, Abbott-Firestone and Fractal analysis. (來自於Image Metrology SPIP™, 的選配的進階影像分析, 用於3D呈現, FFT(外速傅利葉轉換), Abbott-Firestone曲線, 以及碎型分析)

APPLICATIONS(應用)
The MicroXam-100 is capable of addressing a wide range of measurements and applications:

MicroXam-100 能夠用在一個寬廣的測量及應用的範圍.

Surface texture
Precision step height
Surface form
Bio-medical
Medical devices
MEMS
Solar
Semiconductor
Optical components
Precision machined surfaces
Consumer electronic manufacturing
Material characterization
And many more
表面文理, 精確的梯度高度, 表面型狀, 生物醫學, 微機電元件, 太陽光電半導體, 光學組件, 精密機械加工表面, 消費電子產品製造, 材料特性, 及很多其他應用.

PRODUCT DESCRIPTION The MicroXam-100 system provides the widest range of application specific capabilities available to a research grade optical profiler. A variety of options are available to enhance the capabilities of the standard system: MicroXam-100 系統提供了研究等級的光學表面量測儀所能得到的最寬廣的特定應用能力的範圍. 可得到很多的選項, 以加強標準系統的能力.	Hardware Features A variety of objectives ranging from 5x to 50x objectives, with field of view of 100um to 1mm, is available to support both micro- and macro-topography applications. The imaging is accomplished using a 640x480 digital camera sensor array displaying 480x480 images. A four position manual turret comes standard with each system. The manual stage (motorized stage option available) can seat samples up to 100x100x60mm (with XY stage). Extended z-range measurements, as well as focus positioning, can be supported by an optional 10mm z-stage. 硬體的特點: 可取得範圍從5x to 50x, 觀測區域100um to 1mm, 的各種不同的物鏡, 以兼可支援微小及巨觀的型貌量測. 其影像是用640x480 的數位像機感應器陣列所顯示的640x480的影像. 每個系統都有一個四個位置的旋轉台的標準配備. 手動平台(有電動平台可選配)可以放入達100x100x60mm 的樣品(含 XY平面平台). 延伸的Z(垂直)範圍的量測, 以及焦點的定位, 可以經由一個選配的 10 mm的Z(垂直)平台l來支援.
	Measurement Principle(量測原理) 3-D interferometric profiling splits a beam of light, reflecting it off both the test and reference surface. The light then recombines and interference patterns are detected by a high resolution camera. This information is then interpreted to provide height information on a pixel basis, building a highly resolved 3D representation of the surface. 三維干攝式表面量測(系統)將一光束分開, 在測量及參考表面被反射. 之後光線合併, 且其由一個高解析度的相機偵測其干涉圖紋樣式. 接著, 此資訊被解讀, 以提供以像素為基礎的高度資訊, 建立了一個高解析度的表面三為的描繪結果. Software Features(軟體特點) Single-user interface displays data acquisition controls and measurement results in a single window (see example). The software supports direct data export to common Windows programs and image cut and paste functionality. (單一的介面顯示數據擇取的控制項, 以及量測結果於單一視窗當中. 軟體支援直接數據輸出到一般Windows 程式, 及支援影像的減下與貼上的功能). Standard functions include 3D rendering, profile extraction, fast Fourier transform (FFT) filtering, surface and profile parameter calculations, auto light-level adjustment, image stitching for x-y and z, manual stitching and overlay data alignment, and advanced data acquisition functions for difficult surfaces. (標準功能包括三維呈現, 剖面提取,外速傅利葉轉換, 表面及剖面的參數計算, 自動高度-準位的調整, x, y, 及z 方向的影像縫接, 手動縫接及重疊數據的對齊, 以及用於難度較高的表面的進階數據擇取功能. Advanced analysis package option from Image Metrology SPIP™ includes batch processing, ASME and ISO measurement parameters, advanced image processing, volume and area analysis, grain analysis, report writing, and many more features. (來自於 Image Metrology SPIP™的進階的分析配套選項, 包括批次處理, 美國機械工程學會及ISO量測參數, 進階影像處理, 體積及面積的分析, 顆粒分析, 報表撰寫, 以及很多其他功能.
PRODUCT OPTIONS(產品選配項目) Objective Lenses(物鏡) An optional range of interferometer and imaging objectives can be used with the MicroXAM-100 product. KLA-Tencor offers 5x - 50x interferometer objectives. 干攝儀及成巷像物鏡, 有一選配的範圍以配合此MicroXAM-100產品. KLA-Tencor 提供5x to 50x 的各種干攝儀物鏡. Motorized Stages(電動平台) The optional 100mm motorized x-y stage with manual tip/tilt and optional 10mm z-stage is available. 可選配的100mm 電動 x-y 平台, 有一個手動的傾斜裝製, 以及可選配的10mm z方向的平台.	Stitching(縫接) The software option is offered to extend the field of view capabilities of the optical profiler. Allows up to 4x4 images to be stitched together using the automated algorithm or user controlled manual overlay feature. The stitching feature does not have to be predefined in the data acquisition setup, and can be applied at any time after the data is acquired. This feature can be used with any objective lens. Offline Software Analysis(離線軟體分析) Allows data to be analyzed on a remote computer. Also, recipes and sequences can be created, edited and then loaded onto the instrument computer. 此軟體可選配項目, 提供用來延伸此光學表面量測儀的觀測區域. 使用自動演算法或使用者控制的手動重疊功能, 允許達 4x4 個影像能被縫接在一起. 此縫接不用先在數據擇取的設定中先被定義, 可以在數據擇取後的任何時間來實施.這項功能可用於任何可搭配的物鏡. 允許數據可以在遠端電腦上分析. 各種測定設計方法及序列設定也可以在遠端電腦上被產生與編輯, 再被載入儀器的電腦.

Related Products